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| RAPID DEVELOPMENT KIT (RDK) FOR OMAP5912 |
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相关链接请参考:OMAP5912开发工具综述 Overview |
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The Rapid Development Kit for OMAP5912 (RDK) from Mistral helps OMAP™ based Portable Data Terminal (PDT) developers accelerate their product and application development process. The RDK board is a plug-in module for the OMAP5912 O SK from TI, which supports four RF modules: GPS, GSM/GPRS, WLAN and BLUETOOTH on a single board. The RDK provides product developers with an easyto- use means of evaluating the wireless functionality of their end application before finalizing on the product design.
The RDK Bundle includes TI's OMAP Starter Kit (OSK), Mistral's Q-VGA LCD Module (QVLM), Mistral's Camera Module (CMQ) and Mistral's RDK
Board along with Windows® CE runtime and drivers. |
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| Features |
Deliverables |
The RDK Board supports the following features:
• GPS Module interfaced to serial port 2
• Bluetooth Module interfaced to serial port 1, McSI
• GSM Module interfaced to serial port 3, McBSP
• SDIO expansion slot
• USB 2.0 OTG
• On-board 64MB NAND Flash
• Optional CF Form Factor, 1" HDD
• Mistral's Camera Module (CMQ)
• with 640x480 resolution
• 802.11b/g WLAN |
The RDK Bundle includes:
• OSK Board *
• QVLM Board **
• RDK Board **
• CMQ Module
• Windows® CE BSP ↑
• Code Composer StudioTM * |
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* |
Available only as part of Mistral's RDK Bundle. The OSK Board and Code Composer
Studio are available as single products from Spectrum Digital Inc. and TI respectively.
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The QVLM and RDK Boards can be bought separately from Mistral. |
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The RDK bundle is available in two flavors:
(i) With Runtime WinCE License
(ii) With Mistral's WinCE 4.2 Accelerator Program for OMAP5912 |
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| Physical Specifications |
The RDK Board is designed on a multilayer printed circuit board using surface mount technology. The printed circuit board measures 156.5 mm x 95 mm x 21 mm.
When connected, the RDK Bundle measures 156.5 mm x 95 mm x 60 mm. It operates at 5 volts at less than 2500 milliamps. Its operating temperature range is 0℃ to 70℃ (32oF to 158oF).
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| Click here to view Technical Specifications |
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